Results 11 to 19 of 19 | « previous
- Partitioning digital circuits for implementation in multiple FPGA ICs / by Kuznar, Roman.; Brglez, Franček.(CARDINAL)269538; Kozminski, Krzysztof Antoni,1935-(CARDINAL)199172; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references (pages 51-53).
- Subjects: Logic devices.; Electronic circuit design.; Computer software.;
- Transformations and resynthesis for testability of RT-level control-data path specifications / by Bhattacharya, Subhrajit.; Brglez, Franček.(CARDINAL)269538; Dey, Sujit,1963-(CARDINAL)212423; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references (pages 28-29).
- Subjects: Path analysis; Control theory; Logic design.;
- Feasibility of BCB as an interlevel dielectric in integrated circuits / by Bothra, S.; Garrou, P.; Kellam, M.; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references.
- Subjects: Dielectrics.; Integrated circuits;
- Parallel logic simulation of VLSI systems / by Bailey, Mary L.; Briner, Jack V.(Jack Vedder),1961-(CARDINAL)217429; Chamberlain, Roger D.; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references (pages 32-35).
- Subjects: Computer simulation.; Integrated circuits; Logic design.; Parallel processing (Electronic computers);
- Comparative evaluation of optical waveguides as alternative interconnections for high-performance packaging / by Schacham, S. E.; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references (pages 18-20).
- Subjects: Optical wave guides; Microelectronics;
- A review of the skin effect as applied to thin-film interconnections / by Hwang, Lih-Tyng.(CARDINAL)217092; Turlik, Iwona.(CARDINAL)217093; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references (pages 31-35).
- Subjects: Skin effect (Electricity); Thin-film circuits; Microelectronics;
- Calibration issues in piezoresistive strain gauges for stress measurements in electronic packaging / by Sur, Biswajit.; Turlik, Iwona.(CARDINAL)217093; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references.
- Subjects: Integrated circuits; Strain gages;
- The role of surface modification on adhesion at the metal/polymer interface / by Berry, Michael J.(Michael James),1947-(CARDINAL)202029; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references (leaf [7]).
- Subjects: Surfaces (Technology); Polymers; Microelectronics;
- Ultra-shallow junction formation using silicide as a diffusion source and low thermal budget / by Wang, Q. F.; Osburn, C. M.(CARDINAL)196113; Canovai, C. A.(Christopher A.)(CARDINAL)217090; Microelectronics Center of North Carolina.Center for Microelectronics.;
- Includes bibliographical references (pages [14-16]).
- Subjects: Integrated circuits; Surfaces (Technology); Microelectronics;
Results 11 to 19 of 19 | « previous